发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To substantially eliminate protrusion of an adhesive from a joined portion while securing sufficient joint strength between a resin case and a metal base. <P>SOLUTION: Adhesive application grooves 30 are provided on a joined surface 29 of a resin case 16 facing a metal base 10. Top surfaces of adjacent walls forming each adhesive application groove 30 are spaced away from a flat surface of the joined surface 29 and respectively form adhesive escaping spaces 32 between the metal base 10. The adhesive escaping spaces 32 actively guide and accommodate the excessive amount of the adhesive 17 excessively applied on the adhesive application grooves 30. Further, flowing adhesive accommodating grooves 31, which are respectively in communication with the adhesive escaping spaces 32, are provided, thereby surely accommodating the adhesive 17 that could not be accommodated in the adhesive escaping spaces 32. Furthermore, even if the amount of the adhesive 17, which cannot be accommodated by the flowing adhesive accommodating grooves 31, is applied, adhesive flow prevention grooves 33 accommodate the excessive amount of the adhesive 17, and further protrusion is prevented. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012015349(A) 申请公布日期 2012.01.19
申请号 JP20100150931 申请日期 2010.07.01
申请人 FUJI ELECTRIC CO LTD 发明人 SOYANO SHIN
分类号 H01L23/02 主分类号 H01L23/02
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