发明名称 |
Method of manufacturing packages, package, piezoelectric, vibrator, and oscillator |
摘要 |
A method of manufacturing packages includes a welding step for welding a base substrate wafer to a rivet member by heating the base substrate wafer while pressing the same by a forming die from both sides in the thickness direction is provided, wherein a rivet member receiving portion which can receive a distal end of a core member is formed in a receiving die of the forming die, and an inner surface of the rivet member receiving portion is formed into a tapered shape widening from the bottom side toward the opening side. |
申请公布号 |
US2012013415(A1) |
申请公布日期 |
2012.01.19 |
申请号 |
US201113135768 |
申请日期 |
2011.07.14 |
申请人 |
TANGE YOSHIHISA |
发明人 |
TANGE YOSHIHISA |
分类号 |
H01L41/053;H01L41/22;H03B5/36 |
主分类号 |
H01L41/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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