发明名称 |
ASSEMBLY, AND ASSOCIATED METHOD, FOR FORMING A SOLDER CONNECTION |
摘要 |
An assembly, and an associated method, facilitates egress of gasses generated during a solder process, thereby reducing the occurrence of voids in the resultant solder connection. A channel is formed to extend part way through a solder pad. The channel defines a path by which to facilitate the egress of the gas generated during the solder operation. |
申请公布号 |
US2012012376(A1) |
申请公布日期 |
2012.01.19 |
申请号 |
US20100836009 |
申请日期 |
2010.07.14 |
申请人 |
LI FAN;DUONG ANTHONY;HENDERSON WILLIAM;RESEARCH IN MOTION LIMITED |
发明人 |
LI FAN;DUONG ANTHONY;HENDERSON WILLIAM |
分类号 |
H05K1/11;B23K1/00;B23K31/02 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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