Method for processing wafer for e.g. integrated circuit, involves removing division tape attached to annular amplification section as well as annular frame to remove annular reinforcing section

摘要

The method involves receiving a wafer into an aperture of an annular frame, and adhering a division tape at a front surface of the wafer. An annular reinforcing section with which the wafer is held at the frame is disconnected to separate a component region and the annular reinforcing section from each other. The division tape attached to the annular amplification section as well as the frame is removed to remove the annular reinforcing section.