| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pattern structure for an interstage probe, that can measure S parameters between stages of a module including multiple stages of transistors, an interstage measurement method, and a multi-chip module high-frequency circuit. <P>SOLUTION: A pattern structure for an interstage probe comprises a dielectric substrate, a first signal transmission line disposed on a first surface of the dielectric substrate, a pair of first ground terminal electrodes disposed adjacent to the first signal transmission line on the first surface of the dielectric substrate, a first VIA hole disposed below the first ground terminal electrode, and a rear surface ground electrode disposed on a second surface opposite to the first surface of the dielectric substrate and connected to the first ground terminal electrode via the first VIA hole. The first signal transmission line can be connected to a signal terminal of a high-frequency probe, and the pair of first ground terminal electrodes can be connected to a pair of ground terminals of the high-frequency probe. <P>COPYRIGHT: (C)2012,JPO&INPIT |
