| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device in which bonding area of a bonded material to be connected with an outer lead and interconnections can be ensured stably even if the cumulative size of the outer lead of the tape carrier for the semiconductor device varies. <P>SOLUTION: In a tape carrier for a semiconductor device having an insulating film, and interconnections containing inner leads and outer leads on the insulating film, at least a part of a plurality of outer leads 51 provided contiguously to each other is arranged to incline against parallel arrangement where the outer leads 51 are parallel with a plurality of interconnects 52 provided contiguously to a bonded material to which the outer leads 51 are connected. <P>COPYRIGHT: (C)2012,JPO&INPIT |
