| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a prepreg in which inorganic fillers are dispersed uniformly therein, and which can provide a metal-clad laminate excellent in workability and having a low coefficient of thermal expansion despite using aluminum hydroxide together with an inorganic filler such as silica; and to provide a metal-clad laminate and a printed wiring board. <P>SOLUTION: The prepreg comprises a base material impregnated with a resin composition, and the resin composition includes aluminum hydroxide having mean particle diameter of 2.5-4.5 μm and a glass filler whose SiO<SB POS="POST">2</SB>content is 50-65 mass%, whose mean particle diameter is 1.0-3.0 μm, and whose specific gravity is 2.3-2.6 g/cm<SP POS="POST">3</SP>. In the prepreg, the total amount of the aluminum hydroxide and the glass filler contained in the solid material of the resin composition is 30-50 mass%. The metal-clad laminate and the printed wiring board are produced by using the prepreg. <P>COPYRIGHT: (C)2012,JPO&INPIT |
