| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a through-wiring board having a through-via capable of preventing the formation of void. <P>SOLUTION: The present invention provides a through-wiring board with a through-via which comprises: a substrate provided with a through-hole; a conductor which is arranged in the through-hole and electrically connects an upper face and a lower face of the substrate; and resin filled in a gap between the conductor and the through-hole. The invention also provides a manufacturing method of such a through-wiring board. The substrate may be a glass substrate. The resin may be a polyimide. The resin may also be a polymer. Further, the resin may be photo-curable resin which reacts to light and changes into a solid. <P>COPYRIGHT: (C)2012,JPO&INPIT |
