发明名称 THERMAL TYPE OVERLOAD RELAY DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve a mounting structure in order to facilitate the mounting of a reset release on a body case of a thermal type overload relay device. <P>SOLUTION: A thermal type overload relay device include: an outer case; an adjustment dial adjusting setting current; a reset switch resetting a contact opening and closing mechanism in which a contact is opened by applying overcurrent; and a cover mounted on the outer case and preventing an operating error of the adjustment dial. The thermal type overload relay device employs a structure in which a reset release guide capable of operating the reset switch, when the cover is located at a position for preventing an operating error of the adjustment dial, is provided to the cover. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012014989(A) 申请公布日期 2012.01.19
申请号 JP20100151251 申请日期 2010.07.01
申请人 FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD 发明人 KAMOSAKI TAKEO;MORISHITA FUMIHIRO;FURUHATA YUKIO;UCHIYAMA TAKU
分类号 H01H61/01 主分类号 H01H61/01
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