| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor storage device which reduces manufacturing cost by reducing an used amount of an organic substrate. <P>SOLUTION: The semiconductor storage device 10 comprises an organic substrate 11 provided with an external connection terminal 19 on one face and a semiconductor memory chip 15 thereby enabling the semiconductor storage device 10 to be inserted into an external device. The semiconductor storage device 10 further comprises a lead frame 13 and a resin mold part 18. The lead frame has a mount part 21 on which the semiconductor memory chip 15 is mounted and an adhesive part 22 formed to extend from the mount part 21 in an insertion direction to the external device and adhered to the other face of the organic substrate 11. The organic substrate 11 is singulated into a shape, viewed from above, substantially not overlapping the mount part 21. An end part in the insertion direction of the adhesive part 22 is formed in the resin mold part 18. The lead frame 13 further has first extension part 13b formed on the adhesive part 22 to extend to face regions of the resin mold part 18 other than a face region of the resin mold part 18 on the insertion direction side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
