| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a fan-out type semiconductor package, in which a resin sealing process is performed once. <P>SOLUTION: A plurality of semiconductor chips 12 are arranged in a recessed part of a support 24 while the chips are aligned to be separated from each other. The semiconductor chips 12 are sealed with an insulating resin on the support to form a resin sealing part 30. A rewiring pattern 32 is formed on a top surface of the sealing resin part 30 to form an external connection terminal on the rewiring pattern. A bottom face of the recessed part of the support 24 is removed from the resin sealing part 30 while a reinforcement member of the support 24 is left, and the sealing resin part 30 is cut into pieces along an outside of the reinforcement member to manufacture a semiconductor package. <P>COPYRIGHT: (C)2012,JPO&INPIT |
