| 摘要 |
<P>PROBLEM TO BE SOLVED: To maintain air-tightness of a through-wiring board with voids formed therein. <P>SOLUTION: The present invention provides a through-wiring board which comprises: a substrate provided with a through-hole; a through-via for a conductor filled in the through-hole; and resin filled in a void between the through-via and the through-hole. The invention also provides a manufacturing method of such a through-wiring board. The substrate may be a glass substrate. The resin may be a polyimide. The resin may also be a polymer. Further, the resin may be photo-curable resin which reacts to light and changes into a solid. <P>COPYRIGHT: (C)2012,JPO&INPIT |
