| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing method and a plasma processing device that enable boring processing to be performed while suppressing the quantity of heat supplied to a processed work. <P>SOLUTION: A plasma processing device 1 generates a plasma jet 13 by a plasma jet generation part 11 to irradiate a processed work 17 arranged at a container part 15 with the plasma jet 13. At the plasma jet generation part 11, discharge assisting gas is supplied from a first gas supply port 29 to a discharge gas passage 25, and jetted from a nozzle 27 toward the processed work 17. The nozzle 27 includes a second gas supply port 31, and etching assisting gas is supplied from the second gas supply port 31 to the nozzle 27. <P>COPYRIGHT: (C)2012,JPO&INPIT |
