| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a piezoelectric vibration device which reduces cost by having the same structure for its upper and lower plates. <P>SOLUTION: A manufacturing method for a piezoelectric vibration device comprises: a process for preparing a piezoelectric wafer containing multiple piezoelectric frames having a piezoelectric vibration piece and an outer frame to support the piezoelectric vibration piece, and having at least a pair of first through-holes (S101); a frist electrode formation process for forming an excitation electrode and forming a drawer electrode and a first side face electrode (S103); a process for preparing two plate wafers having multiple plates with first and second sides, and having at least a pair of second through-holes (S111); a second electrode formation process for forming an external electrode and a second side face electrode (S113); an encapsulation member positioning process for positioning a non-conductive encapsulation member in an annular form (S12); a joint process for jointing the piezoelectric wafer and the two plate wafers with the encapsulation member (S13); and a third electrode formation process for forming connection electrodes in the first side and the first and second through-holes after the joint process (S14). <P>COPYRIGHT: (C)2012,JPO&INPIT |
