发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE |
摘要 |
An electronic component incorporation substrate and a method for manufacturing the same that provide a high degree of freedom for selecting materials. An electronic component incorporation substrate includes a first structure, which has a substrate and an electronic component. The substrate includes a substrate body having first and second surfaces. A first wiring pattern is formed on the first surface and electrically connected to a second wiring pattern formed on the second surface through a through via. The electronic component is electrically connected to the first wiring pattern. The electronic component incorporation substrate includes a sealing resin, which seals the first structure, and a third wiring pattern, which is connected to the second wiring pattern through a second via. |
申请公布号 |
US2012013021(A1) |
申请公布日期 |
2012.01.19 |
申请号 |
US201113181884 |
申请日期 |
2011.07.13 |
申请人 |
KOBAYASHI KAZUTAKA;ARAI TADASHI;KOBAYASHI TOSHIO;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KOBAYASHI KAZUTAKA;ARAI TADASHI;KOBAYASHI TOSHIO |
分类号 |
H01L23/538;H01L21/768;H01L21/78 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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