摘要 |
A die package structure, which comprises: a first die; a second die; a core material layer, provided between the first die and the second die; at least one via, penetrating through the first die, the second die and the core material layer; a metal material, stuffing into the via, such that the first die the second die, and the core material layer can be electrically contacted with each other; at least a signal contacting unit, contacting the metal material; and a dielectric layer, enclosing the first die, including at least one breach exposing the signal contacting unit.
|