OPTICAL RECEIVER ARCHITECTURE USING A MIRRORED SUBSTRATE
摘要
Techniques and architectures for providing a reflective target area of an integrated circuit die assembly. In an embodiment, a reflective bevel surface of a die allows an optical signal to be received from the direction of a side surface of a die assembly for reflection into a photodetector. In another embodiment, one or more grooves in a coupling surface of the die provide respective leverage points for aligning a target area of the bevel surface with a detecting surface of the photodetector.
申请公布号
WO2012009149(A2)
申请公布日期
2012.01.19
申请号
WO2011US41978
申请日期
2011.06.27
申请人
INTEL CORPORATION;HECK, JOHN;LIU, ANSHENG;PANICCIA, MARIO, J.