| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform processing of a substrate at a plurality of processing sections efficiently in a substrate processing apparatus with the plurality of processing sections. <P>SOLUTION: A developer 30 comprises a processing section 130 with a spin chuck 210 which rotates a wafer W while holding and a cup body 220 provided to surround the side of the wafer W, a first developing solution nozzle 151 discharging a first developing solution onto the wafer W, a second developing solution nozzle 152 discharging a second developing solution onto the wafer W, and a shared arm 150 supporting both the first developing solution nozzle 151 and second developing solution nozzle 152. In the plan view, the discharge direction of the first developing solution being discharged obliquely downward from the first developing solution nozzle 151, and the discharge direction of the second developing solution being discharged obliquely downward from the second developing solution nozzle 152 are the same direction as the rotational direction of the wafer W. <P>COPYRIGHT: (C)2012,JPO&INPIT |
