发明名称 HIGH BANDWIDTH PROBE ASSEMBLY
摘要 <P>PROBLEM TO BE SOLVED: To provide a spring probe block assembly for use in a high bandwidth application. <P>SOLUTION: The spring probe block assembly includes an insulative housing. A probe connector having a signal probe, an insulative layer, and a conductive shell is disposed in the housing. At least one ground probe is also disposed in the housing. The ground probe and the conductive shell of the probe connector are electrically connected by a grounding part. The grounding part is configured to elastically deform the ground probe in such a manner as to create spring energy in the ground probe. The spring energy generates a normal force between the ground probe and the grounding part which retains the ground probe at its position. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012013713(A) 申请公布日期 2012.01.19
申请号 JP20110221783 申请日期 2011.10.06
申请人 THREE M INNOVATIVE PROPERTIES CO 发明人 FELDMAN STEVEN
分类号 G01R1/073;G01R1/04;G01R1/067;H01R13/22;H01R33/74 主分类号 G01R1/073
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