| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition which can realize an adhesive film and also control flow out during press cure while showing outstanding soldering heat resistance, and to provide the adhesive film and a method of manufacturing the same. <P>SOLUTION: The adhesive composition includes (A) an acrylic resin, (B) an epoxy resin, (C) a first curing agent, and (D) a second curing agent, wherein the second curing agent has lower reaction initiating temperature than that of the first curing agent, the epoxy resin (B) is blended at the rate of 12.5-50 parts by mass based on 100 parts by mass of the acrylic resin (A), the first curing agent (C) is blended at the rate of 0.05-0.5 part by mass based on to 100 parts by mass of the acrylic resin, and the second curing agent (D) is blended so as to cause the number of a reactive group to account for 20-70% of the number of a reactive group of the epoxy resin (B). <P>COPYRIGHT: (C)2012,JPO&INPIT |
