| 摘要 |
Apparatus are disclosed, such as those involving integrated circuit packaging. In one embodiment, a chip package (300) includes: an encapsulation (110) having a top surface and a bottom surface facing away from the top surface. The package further includes a leadframe (350) including a plurality of leads (352, 354). Each of the leads includes an exposed portion (352) exposed through one of edges of the bottom surface of the encapsulation. The exposed portion has a length. At least one of exposed portions positioned along one of the edges of the bottom surface of the encapsulation has a length different from other exposed portions along the edge. The package can also include a dummy pad (465a) exposed through a corner of the bottom surface. The configuration can enhance solder joint reliability of the package when the package is attached to a printed circuit board (180). |
