| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide method of manufacturing electronic device, capable of preventing a foreign material from deteriorating electronic device performance and accurately recognizing a position recognition mark. <P>SOLUTION: The method of manufacturing the electronic device comprises: a wiring forming step of forming a wiring 5 on a surface of a substrate 2; a protective film forming step of forming a protective film 6 except a portion which forms an electrode 3 and a position recognition mark 4 on the surface of the substrate 2; an electrode and mark forming step of forming the electrode 3 on the surface of the substrate 2 and forming the position recognition mark 4 in a position apart from the electrode 3 and the wiring 5; a bonding step of bonding a bonding wire 9 to the electrode 3; and a sealing step of sealing the substrate 2 where the wiring 5, electrode 3, and position recognition mark 4 are formed with a sealing member 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
