发明名称 |
A FLEXIBLE ELECTRONIC DEVICE, METHOD FOR MANUFACTURING SAME, AND A FLEXIBLE SUBSTRATE |
摘要 |
The present invention relates to resolving the issues concerning the deterioration in the performance and yield of a flexible electronic device, which are caused by low manufacturing temperature, high surface roughness, a high thermal expansion coefficient, and the bad handling characteristics of a typical flexible substrate. The method for manufacturing a flexible electronic device according to the present invention includes: forming a flexible substrate on a motherboard while physically separating the interface therebetween so that the interfacial bonding therebetween has a yield strength less than that of the flexible substrate; and forming an electronic device on the separated surface of the flexible substrate which had previously been in contact with the motherboard. |
申请公布号 |
WO2012008683(A2) |
申请公布日期 |
2012.01.19 |
申请号 |
WO2011KR03784 |
申请日期 |
2011.05.24 |
申请人 |
POSTECH ACADEMY-INDUSTRY FOUNDATION;LEE, JONG LAM;KIM, KEE SOO |
发明人 |
LEE, JONG LAM;KIM, KEE SOO |
分类号 |
H01L51/56;H01L51/52 |
主分类号 |
H01L51/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|