CARRIER DEVICE FOR A SEMICONDUCTOR CHIP, ELECTRONIC COMPONENT COMPRISING A CARRIER DEVICE AND OPTOELECTRONIC COMPONENT COMPRISING A CARRIER DEVICE

摘要

A carrier device for a semiconductor chip (3) comprising a bondable and/or solderable metallic carrier (1) having a mounting region (21) for the semiconductor chip (3) and a soldering region (20) is specified, wherein the carrier (1) is at least partly covered with a covering material (2), and wherein a solder barrier (4) is arranged between the soldering region (20) and the mounting region (21) at an interface (10) between the carrier (1) and the covering material (2). An electronic component and an optoelectronic component are furthermore specified.