| 摘要 |
Provided is a semiconductor device having a structure with which even when an adhesive with a low viscosity is used in order that the adhesive hardly causes clogging even when a nozzle having a small inner diameter is used and in order to suppress a bleeding width, the adhesive can sufficiently absorb the stress. The semiconductor device comprises a mounting board (3) and a conversion device (1) having a fragile structure, fixed on the surface of the mounting board (3) through an adhesive (4). In the surface of the mounting board (3), a recess (10) is formed at a part of a plane to which the conversion device (1) is bonded through the adhesive (4). The adhesive (4) is filled in at least a part of the recess (10). |
