| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a problem wherein inspection and adjustment in element capacitance cannot be conducted in each element due to the problem regarding circuit, when passive elements are formed within an actual circuit, and a problem that management items are different in the process when a wiring circuit substrate and passive elements are formed. <P>SOLUTION: After an element substrate, where at least a kind of element of resistance element, capacitor and inductor is allocated in the independent state, is formed to the single surface of a thin-film insulating substrate, and each element of the element substrate is inspected and adjusted; a wiring substrate having the wiring layer and the element substrate are laminated, and each element of the element substrate and the wiring layer of the upper and lower wiring substrates are connected with a via connection or through-hole connection in the laminating process of the multilayer wiring substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
