| 摘要 |
A LED module comprises a printed circuit board or a SMD carrier. At least one LED chip is mounted on the board or carrier. A globe top is arranged, i.e. dispensed or mounted, on top of the LED chip and the area of the board or carrier surrounding the LED chip. The surface of the board or carrier, on which the globe top is dispensed, is covered with white reflective material contacting the LED chip, preferably at its side walls. |
