| 摘要 |
<p>A LED lead frame package, a LED package using the LED lead frame package, and a method of manufacturing the LED package. In the manufacture of the LED package, a liquid transparent resin material is disposed over at least two ring-shaped protrusions having a sharp upper edge and inclined sidewalls and at least one ring-shaped groove formed between two of the at least two ring-shaped protrusions, and thus a sealing layer having a convex curvature may be easily formed by using surface tension in one process.</p> |
