发明名称 |
CMP METHOD FOR METAL-CONTAINING SUBSTRATES |
摘要 |
An aqueous chemical-mechanical polishing composition for polishing metal containing substrates comprising an abrasive particle consisting essentially of a primary particle modified with an aluminosilicate layer, and wherein the abrasive particle has a zeta potential measured at pH 2.3 of about −5 mV to about −100 mV. The composition can be used to polish the surface of a tungsten containing substrate. |
申请公布号 |
EP2052048(A4) |
申请公布日期 |
2012.01.18 |
申请号 |
EP20070796716 |
申请日期 |
2007.07.06 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
VACASSY, ROBERT;ZHOU, RENJIE |
分类号 |
C09K3/14;C09G1/02;H01L21/321 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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