发明名称
摘要 <p>A semiconductor device employing silicon carbide, and the like are provided. In the semiconductor device, even when an electrode material and an upper electrode material are different, a problem does not take place at an interface at which these different types of metals are in contact with each other, thus obtaining high reliability in long-term use. The semiconductor device includes: a contact electrode 16 in contact with silicon carbides 14, 18; and an upper electrode 19 electrically conductive to the contact electrode. The contact electrode 16 is formed of an alloy including titanium, aluminum, and silicon, the upper electrode 19 is formed of aluminum or an aluminum alloy, and the upper electrode achieves the electric conduction to the contact electrode with the upper electrode making contact with the contact electrode.</p>
申请公布号 JP4858791(B2) 申请公布日期 2012.01.18
申请号 JP20090124617 申请日期 2009.05.22
申请人 发明人
分类号 H01L21/28;H01L21/336;H01L21/337;H01L21/768;H01L29/12;H01L29/417;H01L29/78;H01L29/808 主分类号 H01L21/28
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