| 摘要 |
Upon applying a copper strike plating to a surface of a substrate made of a copper alloy that was subjected to a heat treatment after a degreasing process and an electrolytic activating process are applied to the surface, a pulse current by which a current appears like a series of pulses only on a polarity side onto which a copper metal is deposited on the surface of the substrate is applied to the substrate in the copper strike plating such that a crystal plane showing a maximum value of an X-ray diffraction intensity of a copper strike plating layer formed on the surface of the substrate corresponds to a (111) plane as a crystal plane showing a maximum value of an X-ray diffraction intensity of the copper layer into which metal crystals made of copper are most densely filled. |
