首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Method of manufacturing pipe body
摘要
申请公布号
EP1121992(B1)
申请公布日期
2012.01.18
申请号
EP20010300945
申请日期
2001.02.02
申请人
RICOH COMPANY, LTD.
发明人
KONDOU, TAKAFUMI;ISHINO, KEIJI
分类号
B21C37/10
主分类号
B21C37/10
代理机构
代理人
主权项
地址
您可能感兴趣的专利
PREPARATION OF BIPOLAR ELEMENT USING POLYCRYSTALINE SILICON
FABRICATION OF SEMICONDUCTOR DEVICE HAVING MULTILAYER WIRING STRUCTURE
LOW TEMPERATURE SURFACE OXIDATION METHOD OF WAFER FOR SEMICONDUCTOR DEVICE
PLASMA PROCESSING SYSTEM
SEMICONDUCTOR DEVICE
EMERGENCY DEVICE FOR ELECTRONIC DEVICE USING REFRIGERANT
SEMICONDUCTOR PRODUCTION DEVICE
SELECTIVE ETCHING METHOD AND FILM THICKNESS MEASURING METHOD FOR EPITAXIAL CRYSTAL LAMINATE STRUCTURE
FABRICATION OF SEMICONDUCTOR DEVICE
METHOD AND SYSTEM FOR PLASMA PROCESSING
SEMICONDUCTOR EPITAXIAL WAFER AND ITS MANUFACTURE
CHEMICAL VAPOR DEPOSITION APPARATUS
LIGHT PROJECTION ALIGNER
SEMICONDUCTOR SILICON WAFER
ELECTROLYTIC CAPACITOR
OIL-FILLED ELECTRIC APPARATUS
NETWORK RESISTOR
MICROWAVE PLASMA TREATMENT DEVICE
MANUFACTURE OF ELECTRIC HEATER USING NONWOVEN FABRIC AND RELEVANT APPARATUS
MOLDING METHOD FOR MOLDING WITH TERMINAL