| 发明名称 |
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION |
| 摘要 |
There is provided a photosensitive adhesive composition having a lowest melt viscosity at 20°C to 200°C after pattern formation of 30,000 Pa·s or lower. |
| 申请公布号 |
EP2319893(A4) |
申请公布日期 |
2012.01.18 |
| 申请号 |
EP20090809741 |
申请日期 |
2009.07.30 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MITSUKURA KAZUYUKI;KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI |
| 分类号 |
C09J201/00;C09J4/00;C09J7/00;C09J7/02;C09J11/06;C09J163/00;C09J179/08;G03F7/004;G03F7/037;H01L21/52 |
主分类号 |
C09J201/00 |
| 代理机构 |
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代理人 |
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