Method of manufacturing circuit board

摘要

There is provided a method of manufacturing a circuit board (40) having a first fixed contact (41) and a second fixed contact (42) that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact (41) being longer than that required for the second fixed contact (42). The method includes: etching a copper foil formed on the entire surface of an insulating substrate to form the patterns of the first and second fixed contacts (41 and 42); polishing the surface of the insulating substrate with buff to remove an oxide film adhered to the copper foil; and sequentially forming a nickel layer having a thickness of 1 to 5 µm and a gold layer having a thickness of 0.01 to 0.5 µm on each of the first and second fixed contacts (41 and 42). In the method, the buffing direction is substantially aligned with a direction in which a first movable contact (44) slides on the first fixed contact (41).