发明名称 Integration of passive device structures with metal gate layers
摘要 A passive device structure includes an unpatterned metal gate layer formed in a passive device region of a semiconductor device; an insulator layer formed upon the unpatterned metal gate layer; a semiconductor layer formed upon the insulator layer; and one or more metal contact regions formed in the semiconductor layer; wherein the insulator layer prevents the metal gate layer as serving as a leakage current path for current flowing through a passive device defined by the semiconductor layer and the one or more metal contact regions.
申请公布号 US8097520(B2) 申请公布日期 2012.01.17
申请号 US20090543544 申请日期 2009.08.19
申请人 BU HUIMING;CHAKRAVARTI SATYA N.;GUO DECHAO;WONG KEITH KWONG HON;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BU HUIMING;CHAKRAVARTI SATYA N.;GUO DECHAO;WONG KEITH KWONG HON
分类号 H01L27/02 主分类号 H01L27/02
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