| 摘要 |
PURPOSE: A wafer ring frame inspection apparatus which is used for a semiconductor chip packaging process is provided to inspect the warpage of a wafer ring frame, the shape of outer circumference and inner circumference, and the deformation of a size with a simple task. CONSTITUTION: An outer side inspection part(30) comprises the feed hopper(38) of a slit type in the side of an upper part. A wafer ring frame(10) is put into the outer side inspection part from outside through the feed holder. The feed hopper is formed by a space between a pair of guides(35) which are arranged in parallel. The inner side(31) of a lower region of the outer side inspection part corresponds with the outer circumference(11) of the wafer ring frame. The outer side(41) of an inner side inspection part(40) corresponds with the inner circumference(12) of the wafer ring frame.
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