发明名称 |
Electronics device package and fabrication method thereof |
摘要 |
Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick. |
申请公布号 |
US8097929(B2) |
申请公布日期 |
2012.01.17 |
申请号 |
US20090398946 |
申请日期 |
2009.03.05 |
申请人 |
LIN CHIA-SHENG;HUANG YU-TING;LAI CHIH-LUNG |
发明人 |
LIN CHIA-SHENG;HUANG YU-TING;LAI CHIH-LUNG |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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