发明名称 |
Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof |
摘要 |
A semiconductor device includes a semiconductor substrate, and a plurality of wiring lines provided on one side of the semiconductor substrate, each of the wiring lines having a connection pad portion. An overcoat film is provided on the wiring lines and the one side of the semiconductor substrate. The overcoat film has a plurality of openings in parts corresponding to the connection pad portions of the wiring lines. A plurality of foundation metal layers are respectively provided on inner surfaces of the openings of the overcoat film and electrically connected to the pat portions of the wiring lines. A plurality of projecting electrodes are respectively provided on the foundation metal layers in the openings of the overcoat film. |
申请公布号 |
US8097941(B2) |
申请公布日期 |
2012.01.17 |
申请号 |
US20090566423 |
申请日期 |
2009.09.24 |
申请人 |
KANEKO NORIHIKO;CASIO COMPUTER CO., LTD. |
发明人 |
KANEKO NORIHIKO |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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