SEMICONDUCTOR DEVICE

摘要

PURPOSE: A semiconductor device is provided to enhance the reliability of a test by synchronizing data and signals which are applied from a test pad and applying to a bump pad without a separate test chip. CONSTITUTION: A chip(CH) of a semiconductor device(10) comprises an internal circuit part(100), a delay time controller(110), a plurality of bump pads(bp), and a plurality of test pads(tp). The plurality of test pads copes with the plurality of bump pads and inputs and outputs test data in the test operation. The delay time controller is connected between the plurality of bump pads and plurality of test pads. The delay time controller delays the test data to different times and synchronizes.