SUBSTRATE FOR MOUNTING AN LED PACKAGE AND MANUFACTURING METHOD THEREOF,申请号KR20100038690-传众专利搜索

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发明名称	SUBSTRATE FOR MOUNTING AN LED PACKAGE AND MANUFACTURING METHOD THEREOF
摘要
申请公布号	KR101105887(B1)	申请公布日期	2012.01.16
申请号	KR20100038690	申请日期	2010.04.26
申请人		发明人
分类号	H05K1/02;H01L33/00	主分类号	H05K1/02
代理机构		代理人
主权项
地址

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