发明名称 METHOD FOR PRODUCING GLASS SUBSTRATE AND METHOD FOR PRODUCING ELECTRONIC PART
摘要 PURPOSE: A manufacturing method of glass substrates and a manufacturing method of electronic components are provided to offer the glass substrates having excellent flatness by installing a penetrating electrode by high position precision. CONSTITUTION: A wire which is composed of a plurality of conductors is held between bases(S1). A plurality of penetrating holes is formed in tow bases. A plurality of wires passes through the plurality of penetrating holes. The wire between the bases is buried to glass(S2). A glass ingot which cools the glass and buries the wire is formed(S3). A glass plate is formed by slicing the glass ingot(S4). A penetrating electrode is formed by grinding the glass plate and exposing the wire to the surface and rear side(S5).
申请公布号 KR20120005396(A) 申请公布日期 2012.01.16
申请号 KR20110067211 申请日期 2011.07.07
申请人 SEIKO INSTRUMENTS INC. 发明人 TERAO EIJI
分类号 H01L21/60;H01L21/02;H01L21/301;H01L23/15 主分类号 H01L21/60
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