发明名称 |
METHOD FOR PRODUCING GLASS SUBSTRATE AND METHOD FOR PRODUCING ELECTRONIC PART |
摘要 |
PURPOSE: A manufacturing method of glass substrates and a manufacturing method of electronic components are provided to offer the glass substrates having excellent flatness by installing a penetrating electrode by high position precision. CONSTITUTION: A wire which is composed of a plurality of conductors is held between bases(S1). A plurality of penetrating holes is formed in tow bases. A plurality of wires passes through the plurality of penetrating holes. The wire between the bases is buried to glass(S2). A glass ingot which cools the glass and buries the wire is formed(S3). A glass plate is formed by slicing the glass ingot(S4). A penetrating electrode is formed by grinding the glass plate and exposing the wire to the surface and rear side(S5). |
申请公布号 |
KR20120005396(A) |
申请公布日期 |
2012.01.16 |
申请号 |
KR20110067211 |
申请日期 |
2011.07.07 |
申请人 |
SEIKO INSTRUMENTS INC. |
发明人 |
TERAO EIJI |
分类号 |
H01L21/60;H01L21/02;H01L21/301;H01L23/15 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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