METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDOUCTOR PACKAGE

摘要

PURPOSE: A method for manufacturing a semiconductor package substrate is provided to prevent the shape deformation of a substrate body by forming reinforcing members in the edge of the substrate body having thin thickness. CONSTITUTION: A substrate body(100) having a first part and the second part is formed. A reinforcing member(300) is formed in the second part. A metal layer which covers the reinforcing members is formed in the first part and the second part. A circuit pattern part(110a) and a reinforced pattern part(110b) are respectively formed in each chip mounting part by patterning the metal layer. An insulating layer(200) having openings which cover the first part and expose a part of the circuit pattern part is formed.