| 摘要 |
<p>Provided is a wireless IC device which makes it possible to allow a wider tolerance for displacement of the mounting position, and reduce manufacturing cost. A wireless IC device 10 includes: (a) a wireless IC chip 24; (b) a feeder circuit board 22 which has the wireless IC chip 24 placed thereon, is magnetically coupled to a radiation plate, supplies electric power to the wireless IC chip 24, and relays signals between the wireless IC chip 24 and the radiation plate; and (c) a substrate 12 on which the feeder circuit board 22 is placed. On the substrate 12, there are formed a plurality of positioning markers 30a, 30b, and 30c indicating the boundaries of a plurality of positioning areas in which the feeder circuit board 22 is selectively placed.</p> |
