发明名称 VERFAHREN UND GERÄT ZUM ZUSAMMENBAU EINER PASTILLE AUF EINEM SUBSTRAT DURCH ZUFUHR VON LÖTMATERIAL
摘要 The process of assembling a component (12) such as a pad on a substrate (14) by providing a mass (16) forming solder joint, comprises forming a vertical stack of coinciding axis with the direction of gravity comprising, from top to bottom, the mass component in a solid state and the substrate, and heating the mass to pass into a liquid state allowing it to spread on the substrate. After formation of the pile, the component is left free to move vertically in two directions, both upwards and downwards. A stabilization of the variation of the vertical position of the component is measured. The process of assembling a component (12) such as a pad on a substrate (14) by providing a mass (16) forming solder joint, comprises forming a vertical stack of coinciding axis with the direction of gravity comprising, from top to bottom, the mass component in a solid state and the substrate, and heating the mass to pass into a liquid state allowing it to spread on the substrate. After formation of the pile, the component is left free to move vertically in two directions, both upwards and downwards. A stabilization of the variation of the vertical position of the component is measured during heating consecutive to a lowering of the component and then the heating of the mass is stopped after a predetermined time counted from the detection of the stabilization. The heating of the mass is carried out by directing a laser beam on a first side of the substrate opposite to a second side of the substrate. An independent claim is included for a device (18) for assembling a component such as a pad on a substrate.
申请公布号 AT540562(T) 申请公布日期 2012.01.15
申请号 AT20090172640T 申请日期 2009.10.09
申请人 VALEO ETUDES ELECTRONIQUES 发明人 VIVET, LAURENT;MORELLE, JEAN-MICHEL;DIMELLI, SANDRA;DENEU-FONTAINE, LAURENT;LENOIR, ROMARIC
分类号 H05K3/34;B23K1/005;B23K3/08;H05K13/04 主分类号 H05K3/34
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