发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE: A semiconductor integrated circuit is provided to greatly reduce number of chip through via by interfacing the signals activated in different operational range through one common chip through via. CONSTITUTION: A master chip(210) includes a multiplexer(212). The multiplexer multiplexes internal output signals(SIGNAL_M1,SIGNAL_M2) to output signals(SIGNAL_TSV1, SIGNAL_TSV2) and outputs the output signal. A slave chip(220) includes a demultiplexer(222) for outputting internal input signals(SIGNAL_S1,SIGNAL_S2). A common chip through via(230) is formed to interface the output signal of a master chip to a slave chip. A bump pad is formed to be electrically connected between the common chip through via and the slave chip.
申请公布号 KR20120004207(A) 申请公布日期 2012.01.12
申请号 KR20100064940 申请日期 2010.07.06
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KU, YOUNG JUN;YUN, TAE SIK
分类号 H01L23/48;H01L23/52;H01L27/06 主分类号 H01L23/48
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