发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT |
摘要 |
PURPOSE: A semiconductor integrated circuit is provided to greatly reduce number of chip through via by interfacing the signals activated in different operational range through one common chip through via. CONSTITUTION: A master chip(210) includes a multiplexer(212). The multiplexer multiplexes internal output signals(SIGNAL_M1,SIGNAL_M2) to output signals(SIGNAL_TSV1, SIGNAL_TSV2) and outputs the output signal. A slave chip(220) includes a demultiplexer(222) for outputting internal input signals(SIGNAL_S1,SIGNAL_S2). A common chip through via(230) is formed to interface the output signal of a master chip to a slave chip. A bump pad is formed to be electrically connected between the common chip through via and the slave chip. |
申请公布号 |
KR20120004207(A) |
申请公布日期 |
2012.01.12 |
申请号 |
KR20100064940 |
申请日期 |
2010.07.06 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
KU, YOUNG JUN;YUN, TAE SIK |
分类号 |
H01L23/48;H01L23/52;H01L27/06 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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