| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piece of vacuum tweezers capable of stably sucking a semiconductor wafer with warpage. <P>SOLUTION: A pair of vacuum tweezers 1 comprises: a long main body 2; a suction part 3 having a plurality of suction surfaces 4 to 6 which is provided at the end part of the main body 2; and at least one suction hole 7 for the suction surfaces 4 to 6 respectively for sucking an object to be processed. At least one suction surface has a bent part 11 in one side and the suction surfaces 4 to 6 are turnably structured centering on the bent parts 11 so that the suction holes 7 can approach or separate from the object to be processed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
