| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be downsized by downsizing a lead frame. <P>SOLUTION: The semiconductor device in which a semiconductor chip 12 is mounted on a chip mount part 23 of a lead frame 22 and the whole is molded by resin comprises a plurality of chip components 14 mounted on the chip mount part 23 each having electrodes on both ends, and bonding wires 16 between respective electrode parts 14b of the plurality of chip components 14 and a plurality of lead parts 24 of the lead frame 22. The electrode parts 14a of the plurality of chip components 14 and the chip mount part 23 are bonded with an electrically-conductive adhesive, and the other electrodes 14b of the plurality of chip components 14 and the chip mount part 23 are bonded with an electrically-insulative adhesive. <P>COPYRIGHT: (C)2012,JPO&INPIT |
