发明名称 LED INTEGRATED STRUCTURE
摘要 A LED integrated structure includes a cooling substrate, LED chips, lenses, plastic parts for positioning or molding the lenses, first through holes are set on the plastic parts for positioning or molding the lenses, and the plastic parts for positioning or molding the lenses are fixed with the cooling substrate; LED chips are directly fixed on the cooling substrate by the crystal solidifying technology, and are set in the first through holes; the layout circuit conductive layer stretches between the lateral wall of the first through hole and the LED chip, the wires are set in the first through holes, one end of the wire is electrically connected with the electrode of the LED chip, the other end of the wire is electrically connected with the layout circuit conductive layer which stretches between the first through hole and the LED chip; the side of the cooling substrate which deviates from the boss contacts with the cooling gas or cooling liquid directly. The present invention has advantages of small thermal resistance of intermediate links, good heat dissipation, accurate location relationship between the chips and the lenses, LED integrated structure with high luminous flux, simple structure, easy assembling, good heat dissipation, and good optical effect.
申请公布号 WO2012003698(A1) 申请公布日期 2012.01.12
申请号 WO2010CN79763 申请日期 2010.12.14
申请人 YANG, DONGZUO 发明人 YANG, DONGZUO
分类号 H01L33/00 主分类号 H01L33/00
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