| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that improves deterioration of a signal waveform due to formation of stub wiring. <P>SOLUTION: A first signal path F is formed as one path which corresponds to a first input terminal Fa and has no branch, and a plurality of first input terminals Fa and a plurality of first terminals T1 of a plurality of semiconductor packages D1 corresponding thereto are connected in a fly-by manner by corresponding ones of a plurality of first signal paths F, respectively. The present invention is applicable to other configurations, not only configurations of a semiconductor package pattern etc., as long as fly-by topology is actualized in the form of one path having no branch. <P>COPYRIGHT: (C)2012,JPO&INPIT |
