| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip and a semiconductor package (a digital receiver) capable of being easily designed in a microwave band. <P>SOLUTION: A semiconductor device comprises: a semiconductor chip; a digital section disposed on the semiconductor chip; an analog RF section disposed on the semiconductor chip; a dielectric having a periodic structure, which is disposed at the location where noise propagated from the digital section can be blocked. <P>COPYRIGHT: (C)2012,JPO&INPIT |
